SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semiconductor chip 1 connected electrically with a package substrate (packaged body) 2 using solder balls 3. The semiconductor chip 1 and the solder balls 3 are electrically connected with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls) 4, and the package substrate 2 and the solder balls 3 are connected electrically with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls).