SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semic...
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| creator | KIMOTO RYOSUKE TONO TOMOKO |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semiconductor chip 1 connected electrically with a package substrate (packaged body) 2 using solder balls 3. The semiconductor chip 1 and the solder balls 3 are electrically connected with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls) 4, and the package substrate 2 and the solder balls 3 are connected electrically with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls). |
| format | Patent |
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SOLUTION: This semiconductor device has a semiconductor chip 1 connected electrically with a package substrate (packaged body) 2 using solder balls 3. The semiconductor chip 1 and the solder balls 3 are electrically connected with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls) 4, and the package substrate 2 and the solder balls 3 are connected electrically with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls).</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000314&DB=EPODOC&CC=JP&NR=2000077557A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000314&DB=EPODOC&CC=JP&NR=2000077557A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIMOTO RYOSUKE</creatorcontrib><creatorcontrib>TONO TOMOKO</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semiconductor chip 1 connected electrically with a package substrate (packaged body) 2 using solder balls 3. The semiconductor chip 1 and the solder balls 3 are electrically connected with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls) 4, and the package substrate 2 and the solder balls 3 are connected electrically with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGQGBubmpq7mhMlCIAvW0fIA</recordid><startdate>20000314</startdate><enddate>20000314</enddate><creator>KIMOTO RYOSUKE</creator><creator>TONO TOMOKO</creator><scope>EVB</scope></search><sort><creationdate>20000314</creationdate><title>SEMICONDUCTOR DEVICE</title><author>KIMOTO RYOSUKE ; TONO TOMOKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000077557A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIMOTO RYOSUKE</creatorcontrib><creatorcontrib>TONO TOMOKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIMOTO RYOSUKE</au><au>TONO TOMOKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2000-03-14</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows enhancement in performance and reliability, even if a semiconductor chip is electrically connected with a packaged body comprising a package substrate and the like using solder balls. SOLUTION: This semiconductor device has a semiconductor chip 1 connected electrically with a package substrate (packaged body) 2 using solder balls 3. The semiconductor chip 1 and the solder balls 3 are electrically connected with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls) 4, and the package substrate 2 and the solder balls 3 are connected electrically with each other via a conductive adhesive body (conductive adhesive body different from the material of the solder balls).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
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