MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor device for making further minuteness without causing degrading of reliability. SOLUTION: A process where a plurality of wirings, wherein a first insulating film is formed on the upper surface and the side surface, are formed o...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIZUTANI TAKAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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