SPUTTERING DEVICE

PROBLEM TO BE SOLVED: To prevent dislocations of wafers without breaking the vacuum in a chamber. SOLUTION: A wafer lift is constituted of wafer supports 1a, wafer support ring 1b, standby lift pins 2, and a standby lift pin support ring 3. The supports 1a have through-holes, into which the lift pin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: UEMATSU TAKAHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent dislocations of wafers without breaking the vacuum in a chamber. SOLUTION: A wafer lift is constituted of wafer supports 1a, wafer support ring 1b, standby lift pins 2, and a standby lift pin support ring 3. The supports 1a have through-holes, into which the lift pins 2 are inserted and the upper ends of the pins 2 come into contact with a wafer (not shown). The lower ends of the pins 2 are fixed to the lift pin support ring 3. When a wafer is placed on the supports 1a in an improper (dislocated wafer) state, the attitude of the wafer is corrected so that the wafer is placed on the supports 1a in a normal state, by moving one end of the wafer which is in contact with one of the pins 2, upward and downward by moving the support ring 3 in the vertical direction.