SURFACE TREATING DEVICE

PROBLEM TO BE SOLVED: To generate uniform plasma in a wide region and to execute uniform surface treatment to a substrate of a large area by using microwaves of a low UHF band of 300 MHz to 1 GHz. SOLUTION: While a gas is fed from a gas feed system 5, exhaution is executed from an exhaust system 6,...

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Bibliographische Detailangaben
Hauptverfasser:	WANI ETSUO, NAKAGAWA KOJIN, SATO HISAAKI, MIURA KOZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To generate uniform plasma in a wide region and to execute uniform surface treatment to a substrate of a large area by using microwaves of a low UHF band of 300 MHz to 1 GHz. SOLUTION: While a gas is fed from a gas feed system 5, exhaution is executed from an exhaust system 6, and the pressure in a treating vessel 3 is held to the prescribed one. Microwaves of a low UHF band are generated by a microwave generator 1 and are resonated in a TM010 mode within a cavity resonator 2. Through an oblong hole 25 formed on a bulkhead board 20, microwaves are radiated into a discharge chamber 4 to form plasma. By utilizing this plasma, the surface of a substrate 30 is subjected to treatment such as etching, CVD or the like. The bottom face of the bulkhead board 20 is projectingly depressed upward, and the gap on the space between the bulkhead board 20 and a substrate mounting stand 31 is made narrow as it is made apart from the center of the substrate 30 to the radial direction. In this way, the plasma is made uniform, and the treatment is also made uniform.