WAFER APPEARANCE INSPECTION DEVICE AND ITS METHOD

PROBLEM TO BE SOLVED: To improve the throughput of an inspection process by providing a defect judgment part comparing the position of a defect area, which is obtained in a pattern area calculation part, with the position of the defect area which is obtained in a defect area calculation part, and ju...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SESHIMA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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