METHOD AND DEVICE FOR LASER BEAM CUTTING

PROBLEM TO BE SOLVED: To prevent the cutting defect at the cross point of a cut line part and a cut line in cutting out an unit panel from a glass base plate, by providing a laser beam irradiating an object to be cut with the laser beam of a prescribed wave, and a cooling means which cools the plann...

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Bibliographische Detailangaben
Hauptverfasser:	JEONG SEONG-WOOK, KIN HEIITSU, CHU DAE-HO, RI GUSHOKU, KIM BOM-SU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent the cutting defect at the cross point of a cut line part and a cut line in cutting out an unit panel from a glass base plate, by providing a laser beam irradiating an object to be cut with the laser beam of a prescribed wave, and a cooling means which cools the planned cut line of the object to be cut after the irradiation. SOLUTION: A primary cut line, i.e., a cut start groove is formed to a start end part Ps of a longitudinal cut line 120, by irradiating a laser beam along the cut line 120 and injecting a low temp. fluid from a fluid injection tube 244, rapid cooling is done. After this thermal expansion, by an extremely high thermal stress due to thermal contraction, a crack is produced along the planned cut line 120 to cut a LCD panel 100. Similarly, cutting is done for a secondary cut line, that is, a lateral direction cut line 120. When a crack is propagated along the secondary cut line 120 to reach a cross point, the cross point cut start groove is formed at the cross point beforehand, the crack passes through the cross point while maintaining linearity, cutting is continued.