MOLD FOR SEMICONDUCTOR RESIN SEALING

PROBLEM TO BE SOLVED: To eliminate the need for adjusting a mold for resin sealing of semiconductor devices taking a great deal of time by preventing fins of resin or the like by suppressing the warpage or deformation of the mold due to thermal stress. SOLUTION: A cavity block 11 and a base of a mol...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SATO EISHIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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