MOLD FOR SEMICONDUCTOR RESIN SEALING

MOLD FOR SEMICONDUCTOR RESIN SEALING

PROBLEM TO BE SOLVED: To eliminate the need for adjusting a mold for resin sealing of semiconductor devices taking a great deal of time by preventing fins of resin or the like by suppressing the warpage or deformation of the mold due to thermal stress. SOLUTION: A cavity block 11 and a base of a mol...

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Bibliographische Detailangaben
1. Verfasser: SATO EISHIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To eliminate the need for adjusting a mold for resin sealing of semiconductor devices taking a great deal of time by preventing fins of resin or the like by suppressing the warpage or deformation of the mold due to thermal stress. SOLUTION: A cavity block 11 and a base of a mold are mechanically fixed to each other by plural bolts 14a, 14b and 14c. The base is divided into plural individual bases 13a, 13b and 13c corresponding to each of the bolts 14a, 14b and 14c. In this way, the warpage or deformation of the mold due to thermal stress produced between the cavity block 11 and the base 13 is suppressed.