METHOD FOR PROCESSING OBJECT TO BE PROCESSED

PROBLEM TO BE SOLVED: To realize a method for processing a semiconductor wafer by which a semiconductor device can be manufactured-without reducing the productivity, even when broken semiconductor wafer is used. SOLUTION: This method is utilized to process a broken semiconductor wafer which is to be used for manufacturing a semiconductor device. The broken semiconductor wafer 1 is restored to an original wafer 1 and is adhered to a specified substrate 5 using a foaming tape 2. Furthermore a resin 6 is coated on the restored semiconductor wafer 1 and it is dried, and a notch is made like the semiconductor wafer 1. Then the foaming tape 2 is foamed, and the semiconductor wafer 1 is peeled into a shape of semiconductor wafer 1, and then the resin 6 is cured by the specified means for curing resin. Thus, the restored semiconductor wafer is post-processed, thereby improving the throughput and yield.