LABEL FOR INMOLDING

PROBLEM TO BE SOLVED: To provide a label for inmolding improved in paper feeding/ejecting property by applying the label stuck container of high welding strength of the label to the container without the occurrence of blister. SOLUTION: Concerning this label for inmolding, a heat seal resin layer is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIINA MAKI, NISHIZAWA TAKATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SEALS SIGNS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a label for inmolding improved in paper feeding/ejecting property by applying the label stuck container of high welding strength of the label to the container without the occurrence of blister. SOLUTION: Concerning this label for inmolding, a heat seal resin layer is provided on the rear side of a polyester resin film substrate layer, in which printing 3 is applied on the front or rear side, emboss working is performed to the surface of the heat seal resin layer so that the center line average height (Sra) can be 1 to 15 μm and in that case, the polyester resin film substrate layer is transparent or non-transparent.