METHOD AND APPARATUS FOR INSPECTING CONDUCTOR PATTERN AND PRODUCTION OF MULTILAYERED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a conductor pattern inspecting method and apparatus capable of performing inspection certainly at a high speed, and a method for producing a multilayered substrate. SOLUTION: A circuit board 51 to be inspected is illuminated by polarized illumination light having a w...

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Hauptverfasser: MIO SHIGEMI, KOBAYASHI HARUOMI, KOSHISHIBA HIROYA, NOMOTO MINEO, ISOBE MITSUNOBU, SENGOKU NORIO, OKUDA HIROTO, IRIE YOKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a conductor pattern inspecting method and apparatus capable of performing inspection certainly at a high speed, and a method for producing a multilayered substrate. SOLUTION: A circuit board 51 to be inspected is illuminated by polarized illumination light having a wavelength of 300-550 nm, and the optical image based on reflected light blocking the polarizing component of the polarized illumination light from the illuminated circuit board to be inspected is detected by a detector to be converted to an optical image signal. The converted optical image signal is binarized on the basis of a predetermined threshold value to be converted to a binary image signal showing a conductor pattern, the positional shift quantity of the conductor pattern is calculated on the basis of the binary image signal showing the converted conductor pattern, and alignment is performed on the basis of the positional shift quantity of the conductor pattern to be compared to extract the defect of the conductor pattern.