INSULATION ADHESIVE FILM
PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linea...
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| creator | AKUTSU YASUSHI SAITO MASAO TAKECHI MOTOHIDE |
| description | PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linear expansion of the film-formed insulating adhesive film or that of the substrate. The insulating adhesive resin 6 is filled with 20-70 wt.% of inorganic particles. In addition, 1-20 wt.% of elastic particles of rubber are dispersed in the insulating adhesive resin 6. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000044895A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000044895A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000044895A3</originalsourceid><addsrcrecordid>eNrjZJDw9AsO9XEM8fT3U3B08XAN9gxzVXDz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkBgYmJhaepoTJQiADVCICo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INSULATION ADHESIVE FILM</title><source>esp@cenet</source><creator>AKUTSU YASUSHI ; SAITO MASAO ; TAKECHI MOTOHIDE</creator><creatorcontrib>AKUTSU YASUSHI ; SAITO MASAO ; TAKECHI MOTOHIDE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linear expansion of the film-formed insulating adhesive film or that of the substrate. The insulating adhesive resin 6 is filled with 20-70 wt.% of inorganic particles. In addition, 1-20 wt.% of elastic particles of rubber are dispersed in the insulating adhesive resin 6.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000215&DB=EPODOC&CC=JP&NR=2000044895A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000215&DB=EPODOC&CC=JP&NR=2000044895A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKUTSU YASUSHI</creatorcontrib><creatorcontrib>SAITO MASAO</creatorcontrib><creatorcontrib>TAKECHI MOTOHIDE</creatorcontrib><title>INSULATION ADHESIVE FILM</title><description>PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linear expansion of the film-formed insulating adhesive film or that of the substrate. The insulating adhesive resin 6 is filled with 20-70 wt.% of inorganic particles. In addition, 1-20 wt.% of elastic particles of rubber are dispersed in the insulating adhesive resin 6.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDw9AsO9XEM8fT3U3B08XAN9gxzVXDz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkBgYmJhaepoTJQiADVCICo</recordid><startdate>20000215</startdate><enddate>20000215</enddate><creator>AKUTSU YASUSHI</creator><creator>SAITO MASAO</creator><creator>TAKECHI MOTOHIDE</creator><scope>EVB</scope></search><sort><creationdate>20000215</creationdate><title>INSULATION ADHESIVE FILM</title><author>AKUTSU YASUSHI ; SAITO MASAO ; TAKECHI MOTOHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000044895A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>AKUTSU YASUSHI</creatorcontrib><creatorcontrib>SAITO MASAO</creatorcontrib><creatorcontrib>TAKECHI MOTOHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKUTSU YASUSHI</au><au>SAITO MASAO</au><au>TAKECHI MOTOHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSULATION ADHESIVE FILM</title><date>2000-02-15</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linear expansion of the film-formed insulating adhesive film or that of the substrate. The insulating adhesive resin 6 is filled with 20-70 wt.% of inorganic particles. In addition, 1-20 wt.% of elastic particles of rubber are dispersed in the insulating adhesive resin 6.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | INSULATION ADHESIVE FILM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T16%3A01%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AKUTSU%20YASUSHI&rft.date=2000-02-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2000044895A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |