INSULATION ADHESIVE FILM

PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linea...

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Bibliographische Detailangaben
Hauptverfasser:	AKUTSU YASUSHI, SAITO MASAO, TAKECHI MOTOHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an insulation adhesive film that can reduce the inner stress in the thermocompression bonding. SOLUTION: This insulating adhesive film 1 is constituted so that the difference from the smaller expansion coefficient is adjusted within 35×10-6/K-1 from the that of linear expansion of the film-formed insulating adhesive film or that of the substrate. The insulating adhesive resin 6 is filled with 20-70 wt.% of inorganic particles. In addition, 1-20 wt.% of elastic particles of rubber are dispersed in the insulating adhesive resin 6.