METHOD FOR DISTRIBUTING CHIP WITH SOLDER BUMP ON FRONT SURFACE USING TAPE FOR CARRYING CHIP

PROBLEM TO BE SOLVED: To provide a method for mounting a flip chip speedily suited for a flip flop bonding by taking out an IC chip. SOLUTION: A tape system for transportation for a flip-chip assembly device is configured so that a chip 14 is taken out of the reverse side of a tape 13 for transporta...

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Bibliographische Detailangaben
Hauptverfasser:	GUTENTAG CHARLES, DUDDERAR THOMAS D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for mounting a flip chip speedily suited for a flip flop bonding by taking out an IC chip. SOLUTION: A tape system for transportation for a flip-chip assembly device is configured so that a chip 14 is taken out of the reverse side of a tape 13 for transportation. In this case an evacuation head 21 of a take-out device 16 touches the reverse side of the IC chip 14, a die take-out pin 17 pushes up the IC chip 14 and takes it out with the circuit side (where a solder bump is located) of the chip 14 facing downward.