MOUNTING BOARD FOR ELECTRONIC COMPONENT AND ITS TEST METHOD

PROBLEM TO BE SOLVED: To obtain a test method wherein a boundary-scan corresponding component on a board on which boundary-scan corresponding components and non- boundary-scan corresponding components are mounted so as to be mixed can be tested in a short time without using an exclusive jig. SOLUTIO...

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Bibliographische Detailangaben
1. Verfasser: IIDA MASAYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a test method wherein a boundary-scan corresponding component on a board on which boundary-scan corresponding components and non- boundary-scan corresponding components are mounted so as to be mixed can be tested in a short time without using an exclusive jig. SOLUTION: A test circuit 4 which is connected to a boundary-scan corresponding component 2 so as to exchange test data is installed. A test control part 3 by which a TAP controller 28 in the boundary-scan corresponding component 2 and the test circuit 4 are controlled is installed. The test data is transmitted from the test control part 3, it is passed in the order of the boundary-scan corresponding component 2, the test circuit 4 and the boundary-scan corresponding component 2, and the test data is received by the test control part 3. The received data is collated with an expected value so as to be tested.