PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME

PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part...

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Hauptverfasser: ISO TOSHIAKI, MESAKI KUNIO, OTSUKA OSAMU, OKI NORIO
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creator ISO TOSHIAKI
MESAKI KUNIO
OTSUKA OSAMU
OKI NORIO
description PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part which is connected with a conductor of another board, and the terminal part is made of copper which is brought into contact with a water solution containing an oxidant and further an alkaline reductant solution. The printed wiring board is manufactured by forming a conductor provided with a terminal part connecting with a conductor of another board, allowing it to be brought into contact with a water solution containing an oxidant, and further allowing it to be brought into contact with an alkaline reductant solution. The resulted printed wiring board is pressurized in a state that its terminal part is overlapped over that of another board in contact with each other, so as to manufacture an assembled body.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000036647A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000036647A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000036647A3</originalsourceid><addsrcrecordid>eNrjZAgLCPL0C3F1UQj3BDLcFZz8HYNcdBQ8Q4IVfB39Qt0cnUNCg1wVHP1cUPj-bgqOwcGuvk4-QK1O_i6RCqHBIO0hHq4KwY6-rjwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMgACIzNzEzMHY2JUgQAxacwvA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME</title><source>esp@cenet</source><creator>ISO TOSHIAKI ; MESAKI KUNIO ; OTSUKA OSAMU ; OKI NORIO</creator><creatorcontrib>ISO TOSHIAKI ; MESAKI KUNIO ; OTSUKA OSAMU ; OKI NORIO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part which is connected with a conductor of another board, and the terminal part is made of copper which is brought into contact with a water solution containing an oxidant and further an alkaline reductant solution. The printed wiring board is manufactured by forming a conductor provided with a terminal part connecting with a conductor of another board, allowing it to be brought into contact with a water solution containing an oxidant, and further allowing it to be brought into contact with an alkaline reductant solution. The resulted printed wiring board is pressurized in a state that its terminal part is overlapped over that of another board in contact with each other, so as to manufacture an assembled body.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000202&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000036647A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000202&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000036647A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISO TOSHIAKI</creatorcontrib><creatorcontrib>MESAKI KUNIO</creatorcontrib><creatorcontrib>OTSUKA OSAMU</creatorcontrib><creatorcontrib>OKI NORIO</creatorcontrib><title>PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part which is connected with a conductor of another board, and the terminal part is made of copper which is brought into contact with a water solution containing an oxidant and further an alkaline reductant solution. The printed wiring board is manufactured by forming a conductor provided with a terminal part connecting with a conductor of another board, allowing it to be brought into contact with a water solution containing an oxidant, and further allowing it to be brought into contact with an alkaline reductant solution. The resulted printed wiring board is pressurized in a state that its terminal part is overlapped over that of another board in contact with each other, so as to manufacture an assembled body.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgLCPL0C3F1UQj3BDLcFZz8HYNcdBQ8Q4IVfB39Qt0cnUNCg1wVHP1cUPj-bgqOwcGuvk4-QK1O_i6RCqHBIO0hHq4KwY6-rjwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMgACIzNzEzMHY2JUgQAxacwvA</recordid><startdate>20000202</startdate><enddate>20000202</enddate><creator>ISO TOSHIAKI</creator><creator>MESAKI KUNIO</creator><creator>OTSUKA OSAMU</creator><creator>OKI NORIO</creator><scope>EVB</scope></search><sort><creationdate>20000202</creationdate><title>PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME</title><author>ISO TOSHIAKI ; MESAKI KUNIO ; OTSUKA OSAMU ; OKI NORIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000036647A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ISO TOSHIAKI</creatorcontrib><creatorcontrib>MESAKI KUNIO</creatorcontrib><creatorcontrib>OTSUKA OSAMU</creatorcontrib><creatorcontrib>OKI NORIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISO TOSHIAKI</au><au>MESAKI KUNIO</au><au>OTSUKA OSAMU</au><au>OKI NORIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME</title><date>2000-02-02</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part which is connected with a conductor of another board, and the terminal part is made of copper which is brought into contact with a water solution containing an oxidant and further an alkaline reductant solution. The printed wiring board is manufactured by forming a conductor provided with a terminal part connecting with a conductor of another board, allowing it to be brought into contact with a water solution containing an oxidant, and further allowing it to be brought into contact with an alkaline reductant solution. The resulted printed wiring board is pressurized in a state that its terminal part is overlapped over that of another board in contact with each other, so as to manufacture an assembled body.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T06%3A05%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ISO%20TOSHIAKI&rft.date=2000-02-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2000036647A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true