PRINTED WIRING BOARD, ITS MANUFACTURE AND MANUFACTURE OF ASSEMBLED BODY USING THE SAME

PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ISO TOSHIAKI, MESAKI KUNIO, OTSUKA OSAMU, OKI NORIO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a printed wiring board which is low in contact resistance and superior in economy, its manufacturing method and a method for manufacturing an assembled body using the printed wiring board. SOLUTION: This printed wiring board is provided with at least a terminal part which is connected with a conductor of another board, and the terminal part is made of copper which is brought into contact with a water solution containing an oxidant and further an alkaline reductant solution. The printed wiring board is manufactured by forming a conductor provided with a terminal part connecting with a conductor of another board, allowing it to be brought into contact with a water solution containing an oxidant, and further allowing it to be brought into contact with an alkaline reductant solution. The resulted printed wiring board is pressurized in a state that its terminal part is overlapped over that of another board in contact with each other, so as to manufacture an assembled body.