METHOD FOR FORMING BUMP CONTACT POINT

PROBLEM TO BE SOLVED: To suppress the peeling and the damage of a bump contact point forming part by applying an ultrasonic wave having vibration components in two directions, which are parallel to the upper face of an electrode pad and are mutually vertical, on the contact part of a metallic ball a...

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1. Verfasser:	KAMEOKA FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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