METHOD FOR FORMING BUMP CONTACT POINT

PROBLEM TO BE SOLVED: To suppress the peeling and the damage of a bump contact point forming part by applying an ultrasonic wave having vibration components in two directions, which are parallel to the upper face of an electrode pad and are mutually vertical, on the contact part of a metallic ball and the electrode pad while the metallic ball formed at the tip of a metallic wire is abutted on the electrode pad. SOLUTION: A metallic ball 5 is formed at the tip of a metallic wire 4 inserted into a capillary 3 by heat energy, and the metallic ball 5 is abutted on the electrode pad 2. An ultrasonic wave having vibration components in two directions, which are parallel to the upper face f the electrode pad 2 and are mutually vertical, is applied to the contact part of the metallic ball 5 and the electrode pad 2. Then, the capillary 3 is raised, the metallic wire 4 is pulled up, a part where the metallic wire 4 is weaken is broken and a projection contact point is formed on the electrode pad 2. Thus, the damage of the electrode pad part 2 in forming the bump contact point is suppressed and the peeling and the damage of a junction part in a later flip mounting process can be prevented.