LEAD FRAME AND ELECTRONIC COMPONENT MANUFACTURING METHOD USING THE FRAME

PROBLEM TO BE SOLVED: To provide a lead frame, which provides a terminal member comprised of a metal plate which is bonded with terminal electrodes formed on each terminal surface of an electronic component unit, facilitates the positional alignment of the terminal member and the electronic component unit and enables sure positional alignment. SOLUTION: This device comprises a pair of terminal members 4, formed by cutting and raising a first part of a metal plate 13 which comprises a lead frame 1 and a pair of positional alignment chips 15 formed by cutting and raising a second part of the metal plate 13. The positional alignment for the terminal members 4 is made by putting an electronic part unit 3 in between, while contacting each terminal electrode 9 and the position alignment for the position alignment chips 15 is made by putting the electronic component unit 3 in between, while making contact with two side surface 5 and 6 respectively.