COOLING DEVICE

PROBLEM TO BE SOLVED: To obtain a cooling device which can improve efficiency of thermal radiation fins and heat collecting fins 6, while saving the resources of fin materials. SOLUTION: This device is equipped with heat collecting fins 5, thermal radiating fins 2, and a heat pipe 1 which transports...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAGOHARA YOSHIJI, HIRAKAWA KOICHI, HARAGUCHI TOMOAKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a cooling device which can improve efficiency of thermal radiation fins and heat collecting fins 6, while saving the resources of fin materials. SOLUTION: This device is equipped with heat collecting fins 5, thermal radiating fins 2, and a heat pipe 1 which transports heat from the heat collecting fins 6 to the thermal radiating fins 2, which consist of a heat pipe fitting part 3 fitted to the heat pipe 1 and plate fins 4 arranged laterally and projected on the flank of the heat pipe fitting part 3 perpendicularly across the gaps. In this case, a gap size S of the plate type fins 4 is 2 mm or larger and 4 to 80% of a projection size L of the plate type fins 4.