IC CARD HOUSING AND PRODUCTION OF THE SAME

PROBLEM TO BE SOLVED: To provide the method for producing a housing for housing an IC card. SOLUTION: This method includes a process of punching a pair of metal covers 16 and 20, at least one of which has a continuous edge provided with plural through-holes separated away from each other inwards alo...

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Bibliographische Detailangaben
1. Verfasser:	KEANE MIKE
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING RECORD CARRIERS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PUNCHING METAL RECOGNITION OF DATA RECORD CARRIERS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide the method for producing a housing for housing an IC card. SOLUTION: This method includes a process of punching a pair of metal covers 16 and 20, at least one of which has a continuous edge provided with plural through-holes separated away from each other inwards along the edge 32. The metal covers 16 and 20 are placed on a mold for an injection molding process. Plastic support materials 18 and 24 are injected into the mold and fitted to the metal covers 16 and 20. Plastic material for the plastic supported material envelopes the continuous edge 32 and flows through the through-holes 34 of the metal covers. The metal covers 16 and 20 and fitted plastic support materials 18 and 24 are removed from the mold. The plastic support materials having a housing 10 formed by the metal covers, and they are bonded to each other so that it an IC card 12 can be housed.