ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus which can reasonably accommodate a heat generation body to be cooled within a casing, while coping with realization of the thin casing. SOLUTION: The electric apparatus includes a casing 4 having a bottom wall 4a, a first circuit board 20 prov...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SASAKI KATSUMARU, YOKOYAMA HISAHIRO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic apparatus which can reasonably accommodate a heat generation body to be cooled within a casing, while coping with realization of the thin casing. SOLUTION: The electric apparatus includes a casing 4 having a bottom wall 4a, a first circuit board 20 provided as opposed to the bottom wall and having a circuit part 21 mounted thereon, and a circuit module 25 accommodated within the casing at such a position as to avoid the first circuit board 20 and electrically connected to the circuit board 20. The circuit module 25 has a second circuit board 26 having an MPU 27 mounted thereon to generate heat during its operation and a heat sink 52 thermally connected to the MPU. The second circuit board 26 is located at a position shifted toward a thick direction of the casing with respect to the first circuit board 20 within the casing, and the heat generation body is positioned on a side of the second board 26 opposed to the first board 20.