METHOD FOR SUPPLYING SEMICONDUCTOR DEVICE TO SUBSTRATE FOR BURN-IN TEST

PROBLEM TO BE SOLVED: To dispense with a conduction test before fitting a semiconductor device to be subjected to a burn-in test to a substrate for testing, to prevent the substrate for testing from being damaged by short-circuiting at the same time, to cope with failure such as open circuit failure...

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1. Verfasser: SAKAZAKI ATSUSHI
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creator SAKAZAKI ATSUSHI
description PROBLEM TO BE SOLVED: To dispense with a conduction test before fitting a semiconductor device to be subjected to a burn-in test to a substrate for testing, to prevent the substrate for testing from being damaged by short-circuiting at the same time, to cope with failure such as open circuit failure other than short circuit failure, and to apply a method to the semiconductor device requiring an external clock. SOLUTION: For a burn-in test that energizes a semiconductor device 5 in a high-temperature atmosphere for a specific amount of time, the semiconductor device 5 is supplied to a substrate 4 for testing where a number of sockets 3 are arranged on an insulating substrate l. At that time, conduction is made to the semiconductor device 5 being fitted to the socket 3, the semiconductor device 5 where the abnormality of the conduction has been confirmed is removed from the substrate 4 for testing.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title METHOD FOR SUPPLYING SEMICONDUCTOR DEVICE TO SUBSTRATE FOR BURN-IN TEST
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