METHOD FOR SUPPLYING SEMICONDUCTOR DEVICE TO SUBSTRATE FOR BURN-IN TEST
PROBLEM TO BE SOLVED: To dispense with a conduction test before fitting a semiconductor device to be subjected to a burn-in test to a substrate for testing, to prevent the substrate for testing from being damaged by short-circuiting at the same time, to cope with failure such as open circuit failure...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To dispense with a conduction test before fitting a semiconductor device to be subjected to a burn-in test to a substrate for testing, to prevent the substrate for testing from being damaged by short-circuiting at the same time, to cope with failure such as open circuit failure other than short circuit failure, and to apply a method to the semiconductor device requiring an external clock. SOLUTION: For a burn-in test that energizes a semiconductor device 5 in a high-temperature atmosphere for a specific amount of time, the semiconductor device 5 is supplied to a substrate 4 for testing where a number of sockets 3 are arranged on an insulating substrate l. At that time, conduction is made to the semiconductor device 5 being fitted to the socket 3, the semiconductor device 5 where the abnormality of the conduction has been confirmed is removed from the substrate 4 for testing. |
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