POLISHING PAD AND POLISHING METHOD

PROBLEM TO BE SOLVED: To effectively utilize slurry since slurry is not held in a groove by a polishing pad, having a lattice-form or a concentric groove and quantities of high-cost slurry is uselessly consumed. SOLUTION: In a polishing pad 11 having a polishing surface 12 approximately in a circula...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAKAJIMA HIDEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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