POLISHING PAD AND POLISHING METHOD

PROBLEM TO BE SOLVED: To effectively utilize slurry since slurry is not held in a groove by a polishing pad, having a lattice-form or a concentric groove and quantities of high-cost slurry is uselessly consumed. SOLUTION: In a polishing pad 11 having a polishing surface 12 approximately in a circula...

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Bibliographische Detailangaben
1. Verfasser:	NAKAJIMA HIDEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To effectively utilize slurry since slurry is not held in a groove by a polishing pad, having a lattice-form or a concentric groove and quantities of high-cost slurry is uselessly consumed. SOLUTION: In a polishing pad 11 having a polishing surface 12 approximately in a circular shape to polish a body to be polished, not show in the figure, a discontinuous groove 13 running from a center to a peripheral edge is formed from the center thereof to a peripheral edge in the polishing surface 12. This constitution causes overflowing of slurry (not shown in the figure), guided in the groove 13, from the interior of the groove 13 and feeds it to the polishing surface 12 outside the groove 13 again in a process of discharge of the slurry to the outside of the polishing surface 12 by a centrifugal force.