REALIZZAZIONE DI DISPOSITIVI ELETTRONICI IN UN WAFER IN MATERIALE SEMICONDUTTORE CON TRINCEE AVENTI DIREZIONI DIVERSE
A method for integrating a set of electronic devices on a wafer (100; 200a; 200b) of semiconductor material having a main surface includes forming a plurality of trenches extending into the wafer from the main surface. At least one layer of electrically insulating material is formed within each tren...
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| Format: | Patent |
| Sprache: | ita |
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