COMPOSIZIONI SENSIBILIZZANTI ATTE A RENDERE UNA SUPERFICIE RICET TIVA ALLA DEPOSIZIONE NON ELETTRO LITICA DI UNO STRATO METALLICO ADERENTE

1349666 Sensitizing solutions for electroless plating KOLLMORGEN CORP 25 June 1971 [29 June 1970] 29874/71 Heading C7F A composition for sensitizing a substrate prior to electroless plating with e.g., Cu, Ni, Co, Pd, Au or Ag comprises (a) a metal complex consisting of a precious metal of the fifth and sixth periods of Groups VIII and IB, (b) a Group IV metal which is capable of two valence states and (c) an anion capable of forming a stable moietz with both valence states of the Group IV metal, the molar ratio of (a) : (b) : (c) being from 1:1:3 to 1:6:24, and these being an excess of component (b) to provide 3 to 100 moles of (b) per mole of component (a). The composition may be incorporated in a plastic substrate. The precious metal may be Pd, Pt, Au, Rh, Os, Ir and salts e.g. chlorides, bromides, fluorides, fluoborates, iodides, nitrates, sulphates, and acetates may be used. The Group IV metal may be stannous tin, Ge, Ti, and may also be in the form of the above salts. The composition may be diluted with an acid, e.g. hydrochloric, hydrofluoric, sulphuric, citric or acetic. The composition may contain a stabilizer e.g. open chain aliphatic mono-ols, diols or polyols and a fluorimated hydrocarbon wetting agent. The composition may be prepared by heating the mixture at 80‹C. to boiling point.