DISPOSITIVO PER LA FUSIONE SUPERFICIALE DEI RIVESTIMENTI GALVANICI DI CIRCUITI STAMPATI

DISPOSITIVO PER LA FUSIONE SUPERFICIALE DEI RIVESTIMENTI GALVANICI DI CIRCUITI STAMPATI

Device to melt off electroplated deposits on plates, esp. of PCB's, consists of a bath with a heat carrier which is circulated through a chamber above the fluid level of the bath. This chamber has inlets and outlets for the heat carrier and in the other walls openings for the inlet and outlet o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: VLADIMIR VASILIEVICH POMAZKOV, NIKOLAI SEMENOVICH PEKOV, GRIGORY ISAAKOVICH DASHEVSKY, JURY LEONIDOVICH SHVOROBEI, VLADIMIR ALEXEEVICH IOVLEV, ANATOLY STEPANOVICH DUBOVIK, ANATOLY ALEXANDROVICH OSIPOV, MIKHAIL FEDOROVICH TREGUBENKO
Format: Patent
Sprache:ita
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Device to melt off electroplated deposits on plates, esp. of PCB's, consists of a bath with a heat carrier which is circulated through a chamber above the fluid level of the bath. This chamber has inlets and outlets for the heat carrier and in the other walls openings for the inlet and outlet of PCB's. Pairs of rollers convey the PCB's through the chamber. This device can handle PCB's of different configuration and thickness at a high productivity.