PROCEDIMENTO PER FABBRICARE DISPOSITIVI A SEMICONDUTTORE E DISPOSITIVO A SEMICONDUTTORE CORRISPONDENTE

Semiconductor devices of the type currently referred to as a System in a Package or SiP and having embedded therein a transformer are produced by embedding at least one semiconductor chip (14) in an insulating encapsulation (180) at a first portion thereof.Over a second portion of the substrate at least partly non-overlapping with the first portion of the substrate (180) having the at least one semiconductor chip (14) embedded therein, stacked structure is formed including a plurality of layers of electrically insulating material (Ll, L2, L3, L4) as well as respective patterns of electrically conductive material. The respective patterns of electrically conductive material have:a planar coil geometry, thus providing electrically conductive coils such as the windings of a transformer (181, 182) ora geometrical distribution providing electrically conductive connections to one or more semiconductor chips (14).