PROCEDIMENTO PER FABBRICARE DISPOSITIVI A SEMICONDUTTORE E DISPOSITIVO A SEMICONDUTTORE CORRISPONDENTE

A semiconductor device (10) comprises a semiconductor die (14) arranged on a substrate such as a leadframe (12A, 12B) and an encapsulation of laser direct structuring, LDS material (16; 161, 162) molded onto the semiconductor die (14).A through mold via or TMV (182) extending through the encapsulati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DERAI, Michele, MAGNI, Pierangelo
Format:	Patent
Sprache:	ita
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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