Dispositivo a semiconduttore e corrispondente procedimento

A semiconductor device comprises a semiconductor die mounted at a die area of a package (10) such as an BGA package with an array of electrically-conductive balls (12) providing electrical contact for the semiconductor die. A power channel (16) is provided to convey a power supply current (CF) to the semiconductor die (14).The power channel (16) comprises one or more electrically-conductive planes (12A) extending in a longitudinal direction of the electrically-conductive plane (12A) between a distal end at the periphery of the package (10) and a proximal end at the die area (14) of the package (10) and a distribution of electrically-conductive balls (12) distributed along a longitudinal direction of the electrically conductive plane (12A).The one or more electrically-conductive planes (12A) comprise subsequent portions in the longitudinal direction between adjacent electrically-conductive balls (12). These subsequent portions have respective electrical resistance values, which are monotonously decreasing (Rshape_8 < Rshape_7 < Rshape_6 < Rshape_5 < Rshape_4 < Rshape_3 < Rshape_2 < Rshape_1) from the distal end to the proximal end of the electrically-conductive plane (12A).A uniform distribution of power supply current (CF) over the length of the power channel is thus facilitated.