PROCESSI PER LA DEPOSIZIONE DI RAMESENZA ELETTRICA' AVENTI RITMI PIU VELOCI DI PLACCATURA

The plating rate of an electroless copper deposition solution which comprises copper ions, a complexing agent for copper ions, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NUZZI FRANCIS J, MCCORMACK JOHN F
Format: Patent
Sprache:ita
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The plating rate of an electroless copper deposition solution which comprises copper ions, a complexing agent for copper ions, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function of a pH above 10 is increased by the addition of an accelerating or depolarizing agent. The accelerating or depolarizing agents include compounds containing a delocalized pi-bond, such as heterocyclic aromatic nitrogen and sulfur compounds, non-aromatic nitrogen compounds having at least one delocalized pi-bond, and aromatic amines. The plating rate is at least 7 microns/hour and the accelerating compound content of the solution is 0.0001-2.5 g/l.