PROCESSI PER LA DEPOSIZIONE DI RAMESENZA ELETTRICA' AVENTI RITMI PIU VELOCI DI PLACCATURA
The plating rate of an electroless copper deposition solution which comprises copper ions, a complexing agent for copper ions, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function...
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Zusammenfassung: | The plating rate of an electroless copper deposition solution which comprises copper ions, a complexing agent for copper ions, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function of a pH above 10 is increased by the addition of an accelerating or depolarizing agent. The accelerating or depolarizing agents include compounds containing a delocalized pi-bond, such as heterocyclic aromatic nitrogen and sulfur compounds, non-aromatic nitrogen compounds having at least one delocalized pi-bond, and aromatic amines. The plating rate is at least 7 microns/hour and the accelerating compound content of the solution is 0.0001-2.5 g/l. |
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