PROCESSO E LIQUIDO PER LA SENSI BILIZZAZIONE CATALITICA DISUPER FICI VON METALLICHI PER LA SUCCHESSIVA METALLIZZAZIONE SENZA ELETTRICITA

The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.

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Bibliographische Detailangaben
1. Verfasser:	HORST STEFFEN
Format:	Patent
Sprache:	ita
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.