"SEMICONDUCTOR CHIP WITH STAIR ARRANGEMENT BUMP STRUCTURES"

"SEMICONDUCTOR CHIP WITH STAIR ARRANGEMENT BUMP STRUCTURES"

Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical conta...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LOW, YIP SENG, TOPACIO, RODEN, R
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads.