Protective fluid for alumina, protection method, and production method for semiconductor substrate having alumina layer using same

The present invention pertains to a protective fluid for alumina. This alumina protective fluid is characterized by: containing 1%-20% by mass of an alkali earth metal, and substantially not containing hydrogen peroxide or having a hydrogen peroxide content of less than 0.002% by mass; and the alkal...

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Bibliographische Detailangaben
Hauptverfasser:	Akinobu HORITA, Toshiyuki OIE, Priangga Perdana PUTRA
Format:	Patent
Sprache:	eng ; heb
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-METALLIC ELEMENTS PAINTS POLISHES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention pertains to a protective fluid for alumina. This alumina protective fluid is characterized by: containing 1%-20% by mass of an alkali earth metal, and substantially not containing hydrogen peroxide or having a hydrogen peroxide content of less than 0.002% by mass; and the alkali earth metal being at least one selected from the group consisting of beryllium, magnesium, strontium, and barium. As a result of the present invention, alumina corrosion can be suppressed during the production process for semiconductor circuits.