METHOD OF POLISHING A SURFACE OF COPPER OR AN ALLOY COMPRISING MAINLY COPPER, MAGNETIC HEAD OBTAINABLE BY MEANS OF SAID METHOD, X-RAY RADIATION-COLLIMATING ELEMENT, BOTH HAVING A SURFACE POLISHED BY MEANS OF THE METHOD, AND POLISHING MEANS FOR USE IN THE

Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm for obtaining a plane and smooth polished surface without any defects. A composition of a polishing...

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Bibliographische Detailangaben
Hauptverfasser:	DE HAAS,PETER WILHELMUS, POSTMA,LAMBERTUS, HAISMA,JAN, DE BOER,DIRK KORNELIS GERHARDUS, VAN DEN HOOGENHOF,WALTHERUS WILHELMUS
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralised water and a chemical activator is used as a polishing means.