SOLDERING FRAME FOR MOUNTING CIRCUIT PLATES

SOLDERING FRAME FOR MOUNTING CIRCUIT PLATES

Jig comprises a frame to hold a printed circuit board a pressure pad, located on a support plate, on top of the frame, parallel guide slots 4A and 4B for the printed circuit board. A baseplate (6), carrying two side walls (7A, 7B) and guide rails (8A, 8B) fixed to the inside of the side walls. The f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KRIZSAN,PETER,HU
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:Jig comprises a frame to hold a printed circuit board a pressure pad, located on a support plate, on top of the frame, parallel guide slots 4A and 4B for the printed circuit board. A baseplate (6), carrying two side walls (7A, 7B) and guide rails (8A, 8B) fixed to the inside of the side walls. The frame (1) is complete with side bars (10A, 10B) which are connected to the base by hinge pins (9A, 9B).