FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD
The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides...
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| creator | KATSUYAMA, Tsukasa MUNEKAWA, Yurika ARAI, Masaya HORI, Atsushi NAKANO, Takeshi |
| description | The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides reliability of the flux residue (adhesiveness and insulation resistance of the residue). This object has been achieved by the flux composition of the present invention comprising a base resin (A), an activator (B), and a paraffin wax (C), in which the paraffin wax (C) comprising 9% by mass or more and 20% by mass or less of isoparaffin and/or cycloparaffin, and the amount of the paraffin wax (C) is from 0.5% by mass to 20% by mass with reference to the total amount of the flux composition. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_HUE057497TT2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>HUE057497TT2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_HUE057497TT23</originalsourceid><addsrcrecordid>eNrjZPBw8wmNUHD29w3wD_YM8fT301EI9vdxcQ1SCHAMDnFFlXH0c1Fw9XF1Dgny9_N0VnD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxHqGuBqbmJpbmISFGxsSoAQAnxi2e</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD</title><source>esp@cenet</source><creator>KATSUYAMA, Tsukasa ; MUNEKAWA, Yurika ; ARAI, Masaya ; HORI, Atsushi ; NAKANO, Takeshi</creator><creatorcontrib>KATSUYAMA, Tsukasa ; MUNEKAWA, Yurika ; ARAI, Masaya ; HORI, Atsushi ; NAKANO, Takeshi</creatorcontrib><description>The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides reliability of the flux residue (adhesiveness and insulation resistance of the residue). This object has been achieved by the flux composition of the present invention comprising a base resin (A), an activator (B), and a paraffin wax (C), in which the paraffin wax (C) comprising 9% by mass or more and 20% by mass or less of isoparaffin and/or cycloparaffin, and the amount of the paraffin wax (C) is from 0.5% by mass to 20% by mass with reference to the total amount of the flux composition.</description><language>eng ; hun</language><subject>ALLOYS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220528&DB=EPODOC&CC=HU&NR=E057497T2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220528&DB=EPODOC&CC=HU&NR=E057497T2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KATSUYAMA, Tsukasa</creatorcontrib><creatorcontrib>MUNEKAWA, Yurika</creatorcontrib><creatorcontrib>ARAI, Masaya</creatorcontrib><creatorcontrib>HORI, Atsushi</creatorcontrib><creatorcontrib>NAKANO, Takeshi</creatorcontrib><title>FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD</title><description>The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides reliability of the flux residue (adhesiveness and insulation resistance of the residue). This object has been achieved by the flux composition of the present invention comprising a base resin (A), an activator (B), and a paraffin wax (C), in which the paraffin wax (C) comprising 9% by mass or more and 20% by mass or less of isoparaffin and/or cycloparaffin, and the amount of the paraffin wax (C) is from 0.5% by mass to 20% by mass with reference to the total amount of the flux composition.</description><subject>ALLOYS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBw8wmNUHD29w3wD_YM8fT301EI9vdxcQ1SCHAMDnFFlXH0c1Fw9XF1Dgny9_N0VnD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxHqGuBqbmJpbmISFGxsSoAQAnxi2e</recordid><startdate>20220528</startdate><enddate>20220528</enddate><creator>KATSUYAMA, Tsukasa</creator><creator>MUNEKAWA, Yurika</creator><creator>ARAI, Masaya</creator><creator>HORI, Atsushi</creator><creator>NAKANO, Takeshi</creator><scope>EVB</scope></search><sort><creationdate>20220528</creationdate><title>FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD</title><author>KATSUYAMA, Tsukasa ; MUNEKAWA, Yurika ; ARAI, Masaya ; HORI, Atsushi ; NAKANO, Takeshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_HUE057497TT23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; hun</language><creationdate>2022</creationdate><topic>ALLOYS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KATSUYAMA, Tsukasa</creatorcontrib><creatorcontrib>MUNEKAWA, Yurika</creatorcontrib><creatorcontrib>ARAI, Masaya</creatorcontrib><creatorcontrib>HORI, Atsushi</creatorcontrib><creatorcontrib>NAKANO, Takeshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KATSUYAMA, Tsukasa</au><au>MUNEKAWA, Yurika</au><au>ARAI, Masaya</au><au>HORI, Atsushi</au><au>NAKANO, Takeshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD</title><date>2022-05-28</date><risdate>2022</risdate><abstract>The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides reliability of the flux residue (adhesiveness and insulation resistance of the residue). This object has been achieved by the flux composition of the present invention comprising a base resin (A), an activator (B), and a paraffin wax (C), in which the paraffin wax (C) comprising 9% by mass or more and 20% by mass or less of isoparaffin and/or cycloparaffin, and the amount of the paraffin wax (C) is from 0.5% by mass to 20% by mass with reference to the total amount of the flux composition.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; hun |
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| subjects | ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD |
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