FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD

The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KATSUYAMA, Tsukasa, MUNEKAWA, Yurika, ARAI, Masaya, HORI, Atsushi, NAKANO, Takeshi
Format:	Patent
Sprache:	eng ; hun
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The object of the present invention is to provide a flux composition and a solder paste composition which ensures good printability without impairing solderability (prevention of occurrence of voids and solder balls) and regardless of the metal mask thickness and opening diameter, and also provides reliability of the flux residue (adhesiveness and insulation resistance of the residue). This object has been achieved by the flux composition of the present invention comprising a base resin (A), an activator (B), and a paraffin wax (C), in which the paraffin wax (C) comprising 9% by mass or more and 20% by mass or less of isoparaffin and/or cycloparaffin, and the amount of the paraffin wax (C) is from 0.5% by mass to 20% by mass with reference to the total amount of the flux composition.