METHOD FOR PRODUCING A SUBSTRATE ADAPTER, SUBSTRATE ADAPTER AND METHOD FOR CONTACTING A SEMICONDUCTOR ELEMENT

METHOD FOR PRODUCING A SUBSTRATE ADAPTER, SUBSTRATE ADAPTER AND METHOD FOR CONTACTING A SEMICONDUCTOR ELEMENT

The present invention relates to a method for manufacturing a substrate adapter (50) which functions to bond a semiconductor device (26) which comprises the following steps of: structuralizing an electrically conductive metal element (15); encapsulating an electrical insulation material (10), especi...

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Bibliographische Detailangaben
Hauptverfasser: SCHÄFER, Michael, BLEIFUSS, Martin, KLEIN, Andreas, ULRICH, Holger, KRILL, Elisa, HINRICH, Andreas, RUDZKI, Jacek, SCHEFUSS, Frank, OSTERWALD, Frank, PAULSEN, Lars, BACHMANN, Christian, BECKER, Martin, BENNING, David
Format: Patent
Sprache:eng ; hun
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention relates to a method for manufacturing a substrate adapter (50) which functions to bond a semiconductor device (26) which comprises the following steps of: structuralizing an electrically conductive metal element (15); encapsulating an electrical insulation material (10), especially, at least a portion of the metal element (15) structuralized by plastic; and applying a bonding material (13) on a first surface (17) of the metal element (15). Therefore, the method is to provide an improved solution with respect to reliability of a power semiconductor apparatus.