SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator and a component (C) in a form of a solvent; and a component (D) in a form of a solder powder. The component (B) in a form of the a...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIZAWA, Shinji, OKUMURA, Satoshi
Format:	Patent
Sprache:	eng ; hun
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator and a component (C) in a form of a solvent; and a component (D) in a form of a solder powder. The component (B) in a form of the activator contains a component (B1) in a form of an aromatic carboxylic acid having a hydroxyl group or an acyl group at an ortho position or a pros position.