SOLDERING NOZZLE DEVICE FOR SELECTIVE WAVE SOLDERING WITH A SEPARATING STRIP ARRANGEMENT

The invention relates to an arrangement of at least two solder-wettable separating strips (6, 7) for a soldering nozzle, for simultaneous wave soldering of rows of soldering points, said rows being arranged so as to be spaced apart. The invention is distinguished by the fact that the depth of the separating strips (6, 7), along the solder influx direction, amounts to at least a multiple of the thickness of the separating strips (6, 7), in order to carry away excess solder from the soldering points by means of surface tension by transfer to the separating strips (6, 7); and also by the fact that the at least two separating strips (6, 7) are oriented exactly parallel to one another and are connected fixedly as a group of separating strips (6, 7) to form a strip assembly (2). The invention makes it possible to carry out wave soldering with a repeatably high quality and also without the formation of solder bridges even in the case of circuit board structures with a very fine pitch. As compared to known devices for carrying away excess solder from the soldering points during wave soldering, the separating strip arrangement embodied as a strip assembly, in accordance with the invention, additionally makes it possible to considerably reduce the complexity for production, handling, assembly, maintenance, cleaning and renewal, and also the respectively associated costs.