HOUSING AND METHOD OF MAKING SAME

A housing for encapsulating a power supply for a sonde is disclosed. The housing includes an inner support over-molded with an outer sleeve. The inner support may be metal or plastic and may include an outer tube and an inner tube that are integral with one another with the outer tube providing the...

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Bibliographische Detailangaben
1. Verfasser:	METZGER, RONALD, ALAN RA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS PRINTED CIRCUITS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A housing for encapsulating a power supply for a sonde is disclosed. The housing includes an inner support over-molded with an outer sleeve. The inner support may be metal or plastic and may include an outer tube and an inner tube that are integral with one another with the outer tube providing the exterior surface of the inner support and being spaced apart from the inner tube except where the inner and outer tubes share a common arc. When both the inner support and the outer sleeve are plastic, the inner support includes a reinforced plastic and the outer sleeve includes a non-reinforced plastic.