ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH
An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component...
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| creator | KONISHI, MISAO |
| description | An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules. |
| format | Patent |
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There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. 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There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. 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There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T17%3A44%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KONISHI,%20MISAO&rft.date=2013-06-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EHK1116511A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |