ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH

An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component...

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Bibliographische Detailangaben
1. Verfasser:	KONISHI, MISAO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules.