INTERPOLYMER RESIN PARTICLES AND THE PREPARATION PROCESS THEREOF

Interpolymer resin particles comprised of 20% to 60% by weight of uncross-linked polyolefin e.g. polyethylene, polypropylene, and from 40% to 80% by weight based on the weight of the particles of a vinyl aromatic monomer, e.g. styrene, that is polymerized in a suspension process or form an interpene...

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Bibliographische Detailangaben
1. Verfasser:	STEVEN M. KRUPINSKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Interpolymer resin particles comprised of 20% to 60% by weight of uncross-linked polyolefin e.g. polyethylene, polypropylene, and from 40% to 80% by weight based on the weight of the particles of a vinyl aromatic monomer, e.g. styrene, that is polymerized in a suspension process or form an interpenetrating network of polyolefin with polymerized vinyl aromatic monomer particles and having a gel content of 0 to 1.5% by weight based on the weight of the particles for improved processability in end-use applications and improved ESCR properties. The interpolymer resin particles have a VICAT softening temperature from about 90°C to about 115°C, and a melt index from 0.2 to 35.0g/10 minutes (Condition G). The particles can be mixed with a blowing agent to form extruded foam articles, such as foam board, and can be used in extrusion, injection molding, rotomolding, and thermoforming processes to form a layer, e.g. sheet, film, and as a tie layer in multi-layer structures to bind adjacent layers consisting of incompatible polymers, i.e. polystyrene and polyethylene for improved rigidity in multi-layer structures.