A CONNECTION STRUCTURE MANUFACTURING METHOD

A connection structure manufacturing method for obtaining a connection structure in which first and second connection terminals are electrically connected, comprises disposing the second connection terminals (connection terminals of a semiconductor element) facing the first connection terminals (con...

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Bibliographische Detailangaben
1. Verfasser:	JUNJI SHINOZAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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